Application
16619343 · CURABLE SILICONE COMPOSITION FOR DIE BONDING USE
Filed 2019-12-04 · Granted · Patent 11384268 (2022-07-12) The official file ↗The patent and its PDF ↗ · Art unit 1765 · Examiner Kuo Liang Peng Easy · CPC C08G 77/20 · Dow Corning Toray Co., Ltd. · HOWARD & HOWARD ATTORNEYS PLLC
Office actions
0
first was Notice of allowance
RCEs
0
no appeal
To first action
29.0 mo
to disposition 31.2 mo
Statutes raised
·
0 actions read