Application

16620317 · WAFER INSPECTION SYSTEM INCLUDING A LASER TRIANGULATION SENSOR

Filed 2019-12-06 · Granted · Patent 11578967 (2023-02-14) The official file ↗The patent and its PDF ↗ · Art unit 2422 · Examiner Samira Monshi Typical · CPC G01B 11/0608 · Rudolph Technologies, Inc. · DICKE BILLIG & CZAJA, PLLC

Office actions

first was Non-final rejection

RCEs

no appeal

To first action

16.1 mo

to disposition 38.3 mo

Statutes raised

3 actions read

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