Application

16661686 · SOLDER BUMP FORMATION USING WAFER WITH RING

Filed 2019-10-23 · Granted · Patent 11264264 (2022-03-01) The official file ↗The patent and its PDF ↗ · Art unit 2815 · Examiner Long Huynh Le Typical · CPC H10W 70/68 · SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC · onsemi (BHB)

Office actions

first was Restriction requirement

RCEs

no appeal

To first action

19.3 mo

to disposition 28.3 mo

Statutes raised

0 actions read

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