Application
16667838 · INTEGRATED FAN-OUT PACKAGE
Filed 2019-10-29 · Granted · Patent 10978405 (2021-04-13) The official file ↗The patent and its PDF ↗ · Art unit 2891 · Examiner Sheila V Clark Easy · CPC H10W 72/20 · Taiwan Semiconductor Manufacturing Co., Ltd. · JCIPRNET
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first was Notice of allowance
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13.4 mo
to disposition 17.5 mo
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