Application

16700592 · SEMICONDUCTOR PACKAGE AND FABRICATING METHOD THEREOF

Filed 2019-12-02 · Granted · Patent 10784232 (2020-09-22) The official file ↗The patent and its PDF ↗ · Art unit 2816 · Examiner Jasmine Jhihan B Clark Easy · CPC H10W 74/019 · Amkor Technology, Inc. · Amkor Technology Singapore Holding Pte. Ltd.

Office actions

first was Notice of allowance

RCEs

no appeal

To first action

5.5 mo

to disposition 9.7 mo

Statutes raised

0 actions read

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