Application

16734309 · METHOD OF FORMING A PACKAGED SEMICONDUCTOR DEVICE HAVING ENHANCED WETTABLE FLANK AND STRUCTURE

Filed 2020-01-04 · Granted · Patent 10825755 (2020-11-03) The official file ↗The patent and its PDF ↗ · Art unit 2899 · Examiner Victor A Mandala Easy · CPC H10W 70/465 · Amkor Technology, Inc. · Law Office of Kevin Jackson

Office actions

first was Non-final rejection

RCEs

no appeal

To first action

2.4 mo

to disposition 10.0 mo

Statutes raised

102 112

1 actions read

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