Application

16788428 · ULTRA-THIN EMBEDDED SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THEREOF

Filed 2020-02-12 · Granted · Patent 11605609 (2023-03-14) The official file ↗The patent and its PDF ↗ · Art unit 2822 · Examiner Tuan A Hoang Hard · CPC H10W 40/00 · General Electric Company · GE GLOBAL PATENT OPERATION

Office actions

first was Restriction requirement

RCEs

no appeal

To first action

10.2 mo

to disposition 37.0 mo

Statutes raised

103 DP

4 actions read

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