PATLY.AIApplication
16804572 · Atomic Layer Etch Process Using Plasma In Conjunction With A Rapid Thermal Activation Process
Filed 2020-02-28 · Granted · Patent 11062912 (2021-07-13) The official file ↗The patent and its PDF ↗ · Art unit 1713 · Examiner Mahmoud Dahimene Typical · CPC H10P 50/287 · Beijing E-Town Semiconductor Technology, Co., LTD · Dority & Manning, P.A. and Mattson Technology, Inc
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first was Non-final rejection
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to disposition 16.5 mo
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