Application

16870360 · Dual Metal Via for Contact Resistance Reduction

Filed 2020-05-08 · Granted · Patent 11349015 (2022-05-31) The official file ↗The patent and its PDF ↗ · Art unit 2829 · Examiner Scott C Stowe Typical · CPC H10D 62/021 · Taiwan Semiconductor Manufacturing Co., Ltd. · Haynes and Boone, LLP (24061)

Office actions

first was Non-final rejection

RCEs

no appeal

To first action

13.4 mo

to disposition 24.7 mo

Statutes raised

112 DP

1 actions read

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