Application

16872292 · DEVICE AND METHOD FOR THERMAL STABILIZATION OF PROBE ELEMENTS USING A HEAT CONDUCTING WAFER

Filed 2020-05-11 · Granted · Patent 11035898 (2021-06-15) The official file ↗The patent and its PDF ↗ · Art unit 2867 · Examiner Giovanni Astacio-Oquendo Typical · CPC G01R 1/0458 · International Test Solutions, Inc. · DLA PIPER LLP (US)

Office actions

first was Non-final rejection

RCEs

no appeal

To first action

1.8 mo

to disposition 13.1 mo

Statutes raised

101 103 112

2 actions read

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