Application

16889735 · EMBEDDED MULTI-DIE INTERCONNECT BRIDGE PACKAGES WITH LITHOTGRAPHICALLY FORMED BUMPS AND METHODS OF ASSEMBLING SAME

Filed 2020-06-01 · Granted · Patent 11043457 (2021-06-22) The official file ↗The patent and its PDF ↗ · Art unit 2899 · Examiner George R Fourson III Easy · CPC H10W 70/65 · Intel Corporation · SCHWABE, WILLIAMSON & WYATT, P.C.

Office actions

first was Notice of allowance

RCEs

no appeal

To first action

8.6 mo

to disposition 12.7 mo

Statutes raised

0 actions read

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