Application

16904404 · STACKABLE FULLY MOLDED SEMICONDUCTOR STRUCTURE WITH VERTICAL INTERCONNECTS

Filed 2020-06-17 · Granted · Patent 11056453 (2021-07-06) The official file ↗The patent and its PDF ↗ · Art unit 2816 · Examiner Mohammad M Choudhry Typical · CPC H10P 72/7424 · Deca Technologies Inc. · BOOTH UDALL, PLC

Office actions

first was Restriction requirement

RCEs

no appeal

To first action

4.7 mo

to disposition 12.6 mo

Statutes raised

103 112

1 actions read

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