Application

16915064 · Semiconductor Device that Uses Bonding Layer to Join Semiconductor Substrates Together

Filed 2020-06-29 · Granted · Patent 11088131 (2021-08-10) The official file ↗The patent and its PDF ↗ · Art unit 2813 · Examiner Stephen W Smoot Easy · CPC H10W 20/40 · Taiwan Semiconductor Manufacturing Co., Ltd. · Intellectual Property Division

Office actions

first was Non-final rejection

RCEs

no appeal

To first action

5.2 mo

to disposition 13.4 mo

Statutes raised

102 103 112

1 actions read

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