Application

16928193 · CHIP-SCALE SENSOR PACKAGE STRUCTURE

Filed 2020-07-14 · Granted · Patent 11552120 (2023-01-10) The official file ↗The patent and its PDF ↗ · Art unit 2829 · Examiner David Matthew Hartman · CPC H10F 77/933 · KINGPAK TECHNOLOGY INC. · Li & Cai Intellectual Property(USA) office

Office actions

first was Non-final rejection

RCEs

no appeal

To first action

20.2 mo

to disposition 29.9 mo

Statutes raised

103 112

2 actions read

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