Application

16930761 · DIE STACKING FOR MULTI-TIER 3D INTEGRATION

Filed 2020-07-16 · Granted · Patent 10930621 (2021-02-23) The official file ↗The patent and its PDF ↗ · Art unit 2812 · Examiner Andrew Q Tran Easy · CPC H10W 90/00 · Advanced Micro Devices, Inc. · Advanced Micro Devices, Inc.

Office actions

first was Notice of allowance

RCEs

no appeal

To first action

2.6 mo

to disposition 7.3 mo

Statutes raised

0 actions read

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