PATLY.AIApplication
16944823 · Direct-Bonded Native Interconnects And Active Base Die
Filed 2020-07-31 · Granted · Patent 11289333 (2022-03-29) The official file ↗The patent and its PDF ↗ · Art unit 2894 · Examiner Brook Kebede Easy · CPC H10W 90/00 · Xcelsis Corporation · HG Law LLP (Adeia)
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first was Non-final rejection
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to disposition 19.9 mo
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