Application

16951511 · Multi-Chip Semiconductor Package

Filed 2020-11-18 · Granted · Patent 11495590 (2022-11-08) The official file ↗The patent and its PDF ↗ · Art unit 2819 · Examiner Patricia D Valenzuela Typical · CPC H10W 90/00 · Taiwan Semiconductor Manufacturing Co., Ltd. · Taiwan Semiconductor Manufacturing Co., Ltd

Office actions

first was Non-final rejection

RCEs

no appeal

To first action

12.5 mo

to disposition 23.7 mo

Statutes raised

102 103

2 actions read

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