Application

16997941 · Semiconductor package for wafer level packaging and manufacturing method thereof

Filed 2020-08-20 · Granted · Patent 10879201 (2020-12-29) The official file ↗The patent and its PDF ↗ · Art unit 2812 · Examiner Andrew Q Tran Easy · CPC H10W 72/90 · Taiwan Semiconductor Manufacturing Co., Ltd. · JCIPRNET

Office actions

first was Notice of allowance

RCEs

no appeal

To first action

1.4 mo

to disposition 4.3 mo

Statutes raised

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