Application

17007454 · SYSTEMS AND METHODS FOR PACKAGING AN ACOUSTIC DEVICE IN AN INTEGRATED CIRCUIT (IC)

Filed 2020-08-31 · Granted · Patent 11855608 (2023-12-26) The official file ↗The patent and its PDF ↗ · Art unit 2842 · Examiner Jung H Kim Typical · CPC H03H 9/1014 · RF360 Singapore Pte. Ltd. · W&T/Qualcomm

Office actions

first was Non-final rejection

RCEs

no appeal

To first action

33.4 mo

to disposition 39.8 mo

Statutes raised

102 103

1 actions read

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