Application

17056188 · METHOD OF ADDITIVELY MANUFACTURING AN INTEGRATED CIRCUIT OF AN INTERCONNECT PACKAGING STRUCTURE

Filed 2020-11-17 · Granted · Patent 12027477 (2024-07-02) The official file ↗The patent and its PDF ↗ · Art unit 2892 · Examiner Sean Ayers Winters Typical · CPC H10W 44/20 · Board of Trustees of Michigan State University · Harness Dickey (MSU)

Office actions

first was Non-final rejection

RCEs

no appeal

To first action

33.8 mo

to disposition 43.5 mo

Statutes raised

103 112

1 actions read

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