Application

17068172 · POLYMER RESIN AND COMPRESSION MOLD CHIP SCALE PACKAGE

Filed 2020-10-12 · Granted · Patent 11508679 (2022-11-22) The official file ↗The patent and its PDF ↗ · Art unit 2899 · Examiner Wilner Jean Baptiste Typical · CPC H10P 54/00 · SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC · onsemi (IPTechLaw)

Office actions

first was Non-final rejection

RCEs

no appeal

To first action

17.7 mo

to disposition 25.3 mo

Statutes raised

103

1 actions read

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