Application

17070763 · PACKAGING WITH SUBSTRATE AND PRINTED CIRCUIT BOARD CUTOUTS

Filed 2020-10-14 · Granted · Patent 11353668 (2022-06-07) The official file ↗The patent and its PDF ↗ · Art unit 2874 · Examiner Michael J Stahl Typical · CPC H10W 90/00 · Cisco Technology, Inc. · PATTERSON & SHERIDAN, LLP/CISC

Office actions

first was Non-final rejection

RCEs

no appeal

To first action

10.3 mo

to disposition 19.7 mo

Statutes raised

102

1 actions read

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