Application

17100007 · Systems and Methods for Releveled Bump Planes for Chiplets

Filed 2020-11-20 · Granted · Patent 11348898 (2022-05-31) The official file ↗The patent and its PDF ↗ · Art unit 2819 · Examiner Stephen M Bradley Hard · CPC H10W 90/00 · Xcelsis Corporation · TESSERA

Office actions

first was Notice of allowance

RCEs

no appeal

To first action

14.3 mo

to disposition 18.3 mo

Statutes raised

0 actions read

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