Application

17110035 · WAFER LEVEL PACKAGE UTILIZING MOLDED INTERPOSER

Filed 2020-12-02 · Granted · Patent 11710693 (2023-07-25) The official file ↗The patent and its PDF ↗ · Art unit 2899 · Examiner Wilner Jean Baptiste Typical · CPC H10W 70/095 · Micron Technology, Inc. · TRASK BRITT, P.C./ MICRON TECHNOLOGY

Office actions

first was Non-final rejection

RCEs

no appeal

To first action

22.5 mo

to disposition 31.7 mo

Statutes raised

1 actions read

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