Application

17115093 · WAFER-LEVEL PACKAGE INCLUDING UNDER BUMP METAL LAYER

Filed 2020-12-08 · Granted · Patent 11810878 (2023-11-07) The official file ↗The patent and its PDF ↗ · Art unit 2899 · Examiner Christopher A Johnson Typical · CPC H10W 72/90 · Samsung Electronics Co., Ltd. · HARNESS, DICKEY & PIERCE, P.L.C.

Office actions

first was Restriction requirement

RCEs

no appeal

To first action

24.5 mo

to disposition 35.0 mo

Statutes raised

103 112

1 actions read

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