Application

17117588 · SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

Filed 2020-12-10 · Granted · Patent 11515226 (2022-11-29) The official file ↗The patent and its PDF ↗ · Art unit 2814 · Examiner Long Pham Easy · CPC H10P 54/00 · Samsung Electronics Co., Ltd. · HARNESS, DICKEY & PIERCE, P.L.C.

Office actions

first was Restriction requirement

RCEs

no appeal

To first action

12.7 mo

to disposition 23.6 mo

Statutes raised

102 103

1 actions read

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