Application

17119711 · Embedded Pad Structures of Three-Dimensional Memory Devices and Fabrication Methods Thereof

Filed 2020-12-11 · Granted · Patent 12219773 (2025-02-04) The official file ↗The patent and its PDF ↗ · Art unit 2893 · Examiner Dzung Tran Typical · CPC H10B 43/35 · Yangtze Memory Technologies Co., Ltd · CONLEY ROSE, P.C.

Office actions

first was Restriction requirement

RCEs

no appeal

To first action

19.6 mo

to disposition 49.8 mo

Statutes raised

103

5 actions read

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