Application

17128194 · CHIP PACKAGE AND METHOD OF FABRICATING THE SAME

Filed 2020-12-21 · Granted · Patent 11502032 (2022-11-15) The official file ↗The patent and its PDF ↗ · Art unit 2817 · Examiner Nicholas J Tobergte Easy · CPC H10W 20/42 · Taiwan Semiconductor Manufacturing Company, Ltd. · JCIPRNET

Office actions

first was Non-final rejection

RCEs

no appeal

To first action

13.9 mo

to disposition 22.8 mo

Statutes raised

102 103

1 actions read

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