Application

17129015 · SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

Filed 2020-12-21 · Granted · Patent 11488934 (2022-11-01) The official file ↗The patent and its PDF ↗ · Art unit 2816 · Examiner Marvin Payen Easy · CPC H10W 90/00 · Amkor Technology Singapore Holding Pte. Ltd. · Amkor Technology Singapore Holding Pte. Ltd.

Office actions

first was Notice of allowance

RCEs

no appeal

To first action

18.1 mo

to disposition 22.3 mo

Statutes raised

0 actions read

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