Application

17129144 · Method for forming hermetic package for a power semiconductor

Filed 2020-12-21 · Granted · Patent 11721600 (2023-08-08) The official file ↗The patent and its PDF ↗ · Art unit 2815 · Examiner David Z Chen Hard · CPC H10W 76/60 · Microsemi Corporation · Glass & Associates (Microchip Cos)

Office actions

first was Non-final rejection

RCEs

no appeal

To first action

20.8 mo

to disposition 31.5 mo

Statutes raised

103

2 actions read

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