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Application

17130170 · SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

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Filed 2020-12-22 · Granted · Patent 11515262 (2022-11-29) The official file ↗The patent and its PDF ↗ · Art unit 2897 · Examiner Neil R Prasad Typical · CPC H10W 72/0198 · SAMSUNG ELECTRONICS CO., LTD. · F. CHAU & ASSOCIATES, LLC

Office actions
1
first was Non-final rejection
RCEs
0
no appeal
To first action
14.8 mo
to disposition 23.2 mo
Statutes raised
103
1 actions read
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