Application

17131701 · DIELECTRIC CAPACITANCE RECOVERY OF INTER-LAYER DIELECTRIC LAYERS FOR ADVANCED INTEGRATED CIRCUIT STRUCTURE FABRICATION

Filed 2020-12-22 · Granted · Patent 12394722 (2025-08-19) The official file ↗The patent and its PDF ↗ · Art unit 2818 · Examiner Niki Hoang Nguyen Easy · CPC H10W 20/495 · Intel Corporation · SCHWABE, WILLIAMSON & WYATT, P.C.

Office actions

first was Non-final rejection

RCEs

no appeal

To first action

35.3 mo

to disposition 55.9 mo

Statutes raised

102 103

2 actions read

Unlock the prosecution timelineIncluded in Pro, from $29 a month. Cancel any time.