Application

17133080 · METAL LINE AND VIA BARRIER LAYERS, AND VIA PROFILES, FOR ADVANCED INTEGRATED CIRCUIT STRUCTURE FABRICATION

Filed 2020-12-23 · Abandoned The official file ↗ · Art unit 2897 · Examiner Jahae Kim Hard · CPC H10W 20/033 · Intel Corporation · SCHWABE, WILLIAMSON & WYATT, P.C.

Office actions

first was Restriction requirement

RCEs

no appeal

To first action

35.9 mo

to disposition 67.1 mo

Statutes raised

102 103 112

4 actions read

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