Application

17134756 · OPTICAL DIE-LAST WAFER-LEVEL FANOUT PACKAGE WITH FIBER ATTACH CAPABILITY

Filed 2020-12-28 · Pending The official file ↗ · Art unit 2899 · Examiner Abbigale A Boyle Hard · CPC G02B 6/136 · ADVANCED MICRO DEVICES, INC. · Advanced Micro Devices, Inc.

Office actions

first was Restriction requirement

RCEs

no appeal

To first action

8.4 mo

to disposition n/a

Statutes raised

103 112

5 actions read

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