Application

17135700 · THREE DIMENSIONAL PACKAGE FOR SEMICONDUCTOR DEVICES AND EXTERNAL COMPONENTS

Filed 2020-12-28 · Granted · Patent 11631632 (2023-04-18) The official file ↗The patent and its PDF ↗ · Art unit 2813 · Examiner Marc Anthony Armand Easy · CPC H10W 70/465 · Texas Instruments Incorporated · TEXAS INSTRUMENTS INCORPORATED

Office actions

first was Restriction requirement

RCEs

no appeal

To first action

11.7 mo

to disposition 27.6 mo

Statutes raised

102 103

2 actions read

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