Application

17185742 · MODIFIED LEADFRAME DESIGN WITH ADHESIVE OVERFLOW RECESSES

Filed 2021-02-25 · Granted · Patent 11552007 (2023-01-10) The official file ↗The patent and its PDF ↗ · Art unit 2817 · Examiner Anthony Ho Easy · CPC H10W 74/127 · STMicroelectronics, Inc. · Seed IP Law Group LLP/STMicroelectronics

Office actions

first was Notice of allowance

RCEs

no appeal

To first action

18.7 mo

to disposition 22.5 mo

Statutes raised

0 actions read

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