Application

17190651 · ETCHING METHOD AND PLASMA PROCESSING APPARATUS

Filed 2021-03-03 · Granted · Patent 11569094 (2023-01-31) The official file ↗The patent and its PDF ↗ · Art unit 1713 · Examiner Lan Vinh Typical · CPC H10P 50/242 · Tokyo Electron Limited · IPUSA, P.L.L.C

Office actions

first was Non-final rejection

RCEs

no appeal

To first action

13.1 mo

to disposition 23.0 mo

Statutes raised

102 103

1 actions read

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