Application

17190885 · ESTIMATING HEIGHTS OF DEFECTS IN A WAFER BY SCALING A 3D MODEL USING AN ARTIFICIAL NEURAL NETWORK

Filed 2021-03-03 · Granted · Patent 12057336 (2024-08-06) The official file ↗The patent and its PDF ↗ · Art unit 2877 · Examiner Hwa S Lee Hard · CPC G01N 23/2251 · SAMSUNG ELECTRONICS CO., LTD. · F. CHAU & ASSOCIATES, LLC

Office actions

first was Restriction requirement

RCEs

no appeal

To first action

32.4 mo

to disposition 41.1 mo

Statutes raised

101 112

1 actions read

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