Application

17295354 · SOLDER ALLOY, SOLDER PASTE, SOLDER BALL, SOLDER PREFORM, AND SOLDER JOINT

Filed 2021-05-19 · Granted · Patent 11571770 (2023-02-07) The official file ↗The patent and its PDF ↗ · Art unit 1733 · Examiner Weiping Zhu Hard · CPC B23K 35/262 · SENJU METAL INDUSTRY CO., LTD. · NIXON PEABODY, LLP

Office actions

first was Non-final rejection

RCEs

no appeal

To first action

8.1 mo

to disposition 20.7 mo

Statutes raised

103 DP

2 actions read

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