Application

17313073 · METHOD AND PROCEDURE FOR MINIATURING A MULTI-LAYER PCB

Filed 2021-05-06 · Granted · Patent 11523502 (2022-12-06) The official file ↗The patent and its PDF ↗ · Art unit 2847 · Examiner Hoa Cao Nguyen Typical · CPC H05K 1/0218 · Veea Inc. · THE MARBURY LAW GROUP, PLLC

Office actions

first was Non-final rejection

RCEs

no appeal

To first action

13.8 mo

to disposition 19.0 mo

Statutes raised

102 103 112

1 actions read

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