Application

17327053 · CHIP HEAT DISSIPATION STRUCTURE, CHIP STRUCTURE, CIRCUIT BOARD AND SUPERCOMPUTING DEVICE

Filed 2021-05-21 · Granted · Patent 12100639 (2024-09-24) The official file ↗The patent and its PDF ↗ · Art unit 2899 · Examiner Jaehwan Oh Easy · CPC H10W 40/778 · Bitmain Technologies Inc. · AMPACC Law Group, PLLC

Office actions

first was Non-final rejection

RCEs

no appeal

To first action

33.3 mo

to disposition 40.1 mo

Statutes raised

102

1 actions read

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