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Application

17380250 · METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE HAVING WIDENED OPENINGS IN THE HARD MASK LAYER AND A RECESSED PRE-FILLER SIDE-WALL LAYER

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Filed 2021-07-20 · Granted The official file ↗ · Art unit 2893 · Examiner Anh D Mai Hard · CPC H10D 12/031 · Infineon Technologies Dresden GmbH & Co. KG · MURPHY, BILAK & HOMILLER/INFINEON TECHNOLOGIES

Office actions
4
first was Restriction requirement
RCEs
1
appealed
To first action
21.8 mo
to disposition 60.6 mo
Statutes raised
102 103 112
4 actions read
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