Application

17387617 · SUBSTRATE, ASSEMBLY AND METHOD FOR WAFER-TO-WAFER HYBRID BONDING

Filed 2021-07-28 · Granted · Patent 11769750 (2023-09-26) The official file ↗The patent and its PDF ↗ · Art unit 2899 · Examiner Wilner Jean Baptiste Typical · CPC H10W 90/00 · IMEC VZW · MCDONNELL BOEHNEN HULBERT & BERGHOFF LLP

Office actions

first was Restriction requirement

RCEs

no appeal

To first action

12.7 mo

to disposition 26.0 mo

Statutes raised

102

1 actions read

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