Application

17433349 · PACKAGING SUBSTRATE WITH CORE LAYER AND CAVITY STRUCTURE AND SEMICONDUCTOR DEVICE COMPRISING THE SAME

Filed 2021-08-24 · Granted · Patent 11652039 (2023-05-16) The official file ↗The patent and its PDF ↗ · Art unit 2826 · Examiner Alexander O Williams Typical · CPC H10W 70/685 · ABSOLICS INC. · NSIP LAW

Office actions

first was Non-final rejection

RCEs

no appeal

To first action

7.9 mo

to disposition 20.7 mo

Statutes raised

103

1 actions read

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