Application

17541440 · Printed circuit board module, printed circuit board element, heatsink, heat-conducting element and method of producing a thermally conductive layer

Filed 2021-12-03 · Granted · Patent 12028963 (2024-07-02) The official file ↗The patent and its PDF ↗ · Art unit 2835 · Examiner Amir A. Jalali Typical · CPC H05K 1/0209 · Schweizer Electronic AG · FRESH IP PLC

Office actions

first was Non-final rejection

RCEs

no appeal

To first action

14.6 mo

to disposition 30.9 mo

Statutes raised

102 103

4 actions read

Unlock the prosecution timelineIncluded in Pro, from $29 a month. Cancel any time.