Application

17556341 · SEMICONDUCTOR PACKAGE INTERCONNECT AND POWER CONNECTION BY METALLIZED STRUCTURES ON PACKAGE BODY

Filed 2021-12-20 · Abandoned The official file ↗ · Art unit 2896 · Examiner Lauren R Bell Hard · CPC H10W 90/811 · Infineon Technologies AG · MURPHY, BILAK & HOMILLER/INFINEON TECHNOLOGIES

Office actions

first was Restriction requirement

RCEs

no appeal

To first action

29.4 mo

to disposition 46.0 mo

Statutes raised

112

1 actions read

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