Application

17571092 · SOLDER PADS WITH CONCAVE EDGES FOR BALL GRID ARRAYS

Filed 2022-01-07 · Granted · Patent 12328826 (2025-06-10) The official file ↗The patent and its PDF ↗ · Art unit 2815 · Examiner Jacob Theodore Nelson Easy · CPC H10W 90/701 · MOTOROLA SOLUTIONS, INC. · PERRY + CURRIER INC. (FOR MSI)

Office actions

first was Non-final rejection

RCEs

no appeal

To first action

29.5 mo

to disposition 41.1 mo

Statutes raised

102 103

2 actions read

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