Application

17611086 · BONDING DEVICE AS WELL AS METHOD FOR BONDING SUBSTRATES

Filed 2021-11-12 · Granted · Patent 12009230 (2024-06-11) The official file ↗The patent and its PDF ↗ · Art unit 1745 · Examiner Christopher C Caillouet Typical · CPC H10P 72/0428 · SUSS MicroTec Lithography GmbH · HAYES SOLOWAY P.C.

Office actions

first was Notice of allowance

RCEs

no appeal

To first action

28.4 mo

to disposition 30.9 mo

Statutes raised

0 actions read

Unlock the prosecution timelineIncluded in Pro, from $29 a month. Cancel any time.