Application

17626500 · HEAT SINK AND SEMICONDUCTOR MODULE

Filed 2022-01-12 · Granted · Patent 12205867 (2025-01-21) The official file ↗The patent and its PDF ↗ · Art unit 2898 · Examiner Moin M Rahman Typical · CPC H10W 40/47 · Mitsubishi Electric Corporation · Xsensus

Office actions

first was Non-final rejection

RCEs

no appeal

To first action

29.8 mo

to disposition 36.3 mo

Statutes raised

102 112

1 actions read

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