PATLY.AIApplication
17664466 · METHOD OF FORMING AN INTERCONNECT STRUCTURE OF A SEMICONDUCTOR DEVICE
Filed 2022-05-23 · Pending The official file ↗ · Art unit 2818 · Examiner Jaesun Lee Typical · CPC H10W 20/084 · Taiwan Semiconductor Manufacturing Company, Ltd. · LORENZ & KOPF, LLP (TSMC)
Office actions
1
first was Non-final rejection
RCEs
0
no appeal
To first action
31.2 mo
to disposition n/a
Statutes raised
103
1 actions read